Formation of highly aluminum-doped p-type silicon regions by in-line high-rate evaporation

authored by
Christoph Mader, Robert Bock, Jan Schmidt, Rolf Brendel
Abstract

Highly aluminum-doped p-type silicon regions are formed by in-line high-rate evaporation of aluminum. We deposit aluminum layers of 28 μm thickness at dynamic deposition rates of 20 μm×m/min on p-type silicon substrates. Due to the high substrate temperature of up to 770 °C during deposition an Al-doped p region is formed. Using the camera-based dynamic infrared lifetime mapping technique we measure emitter saturation current densities of 695±65 fA/cm2 for the fully metalized Al-p regions, which corresponds to an implied solar cell open-circuit voltage of 635±2 mV.

External Organisation(s)
Institute for Solar Energy Research (ISFH)
Type
Article
Journal
Solar Energy Materials and Solar Cells
Volume
95
Pages
1720-1722
No. of pages
3
ISSN
0927-0248
Publication date
07.2011
Publication status
Published
Peer reviewed
Yes
ASJC Scopus subject areas
Electronic, Optical and Magnetic Materials, Renewable Energy, Sustainability and the Environment, Surfaces, Coatings and Films
Sustainable Development Goals
SDG 7 - Affordable and Clean Energy
Electronic version(s)
https://doi.org/10.1016/j.solmat.2011.01.039 (Access: Closed)