Surface passivation of high-efficiency silicon solar cells by atomic-layer-deposited Al2O3

authored by
J. Schmidt, A. Merkle, R. Brendel, B. Hoex, M. C.M. Van De Sanden, W. M.M. Kessels
Abstract

Atomic-layer-deposited aluminium oxide (Al2O3) is applied as rear-surface-passivating dielectric layer to passivated emitter and rear cell (PERC)-type crystalline silicon (c-Si) solar cells. The excellent passivation of low-resistivity p-type silicon by the negative-charge-dielectric Al2O3 is confirmed on the device level by an independently confirmed energy conversion efficiency of 20 6%. The best results are obtained for a stack consisting of a 30 nm Al2O3 film covered by a 200 nm plasma-enhanced-chemical-vapour-deposited silicon oxide (SiOx) layer, resulting in a rear surface recombination velocity (SRV) of 70cm/s. Comparable results are obtained for a 130 nm single-layer of Al 2O3, resulting in a rear SRV of 90 cm/s.

External Organisation(s)
Institute for Solar Energy Research (ISFH)
Eindhoven University of Technology (TU/e)
Type
Article
Journal
Progress in Photovoltaics: Research and Applications
Volume
16
Pages
461-466
No. of pages
6
ISSN
1062-7995
Publication date
09.2008
Publication status
Published
Peer reviewed
Yes
ASJC Scopus subject areas
Electronic, Optical and Magnetic Materials, Renewable Energy, Sustainability and the Environment, Condensed Matter Physics, Electrical and Electronic Engineering
Sustainable Development Goals
SDG 7 - Affordable and Clean Energy
Electronic version(s)
https://doi.org/10.1002/pip.823 (Access: Closed)