Qualification of encapsulation materials for module-level-processing

authored by

Verena Steckenreiter, Renate Horbelt, Daniel Nilsen Wright, Martin Nese, Rolf Brendel

Abstract

Module-level-processing applies cell processing and/or cell interconnection processes while the silicon wafers are attached to a sub- or superstrate, such as the module glass. This thin-film/wafer-hybrid- silicon (HySi) approach offers unique possibilities when using ultra-thin silicon wafers that can hardly be processed free-standing. Liquid adhesives are one option for attaching the wafers to the module glass. Here, we analyze the compatibility of a selection of adhesives with module-level processing. The adhesives have to be stable during wet chemical steps and during thermal treatments. A further requirement is that outgassing from the adhesives should be sufficiently low to allow efficient surface passivation by e.g. plasma enhanced chemical vapor deposition. The adhesives have to withstand UV-irradiation and thermal exposure in order to fulfill warranty requirements. In this work we develop and apply tests for the screening of adhesives. We find that certain liquid addition-curing 2-part silicones pass all the tests and are thus attractive candidates for module-level-processing.

Organisation(s)

Solar Energy Section

External Organisation(s)

Institute for Solar Energy Research (ISFH)
Renewable Energy Corporation (REC)

Type

Article

Journal

Solar Energy Materials and Solar Cells

Volume

120

Pages

396-401

No. of pages

6

ISSN

0927-0248

Publication date

2014

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials, Renewable Energy, Sustainability and the Environment, Surfaces, Coatings and Films

Sustainable Development Goals

SDG 7 - Affordable and Clean Energy

Electronic version(s)

https://doi.org/10.1016/j.solmat.2013.06.012 (Access: Closed)