Qualification of encapsulation materials for module-level-processing

verfasst von

Verena Steckenreiter, Renate Horbelt, Daniel Nilsen Wright, Martin Nese, Rolf Brendel

Abstract

Module-level-processing applies cell processing and/or cell interconnection processes while the silicon wafers are attached to a sub- or superstrate, such as the module glass. This thin-film/wafer-hybrid- silicon (HySi) approach offers unique possibilities when using ultra-thin silicon wafers that can hardly be processed free-standing. Liquid adhesives are one option for attaching the wafers to the module glass. Here, we analyze the compatibility of a selection of adhesives with module-level processing. The adhesives have to be stable during wet chemical steps and during thermal treatments. A further requirement is that outgassing from the adhesives should be sufficiently low to allow efficient surface passivation by e.g. plasma enhanced chemical vapor deposition. The adhesives have to withstand UV-irradiation and thermal exposure in order to fulfill warranty requirements. In this work we develop and apply tests for the screening of adhesives. We find that certain liquid addition-curing 2-part silicones pass all the tests and are thus attractive candidates for module-level-processing.

Organisationseinheit(en)

Abt. Solarenergie

Externe Organisation(en)

Institut für Solarenergieforschung GmbH (ISFH)
Renewable Energy Corporation (REC)

Typ

Artikel

Journal

Solar Energy Materials and Solar Cells

Band

120

Seiten

396-401

Anzahl der Seiten

6

ISSN

0927-0248

Publikationsdatum

2014

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektronische, optische und magnetische Materialien, Erneuerbare Energien, Nachhaltigkeit und Umwelt, Oberflächen, Beschichtungen und Folien

Ziele für nachhaltige Entwicklung

SDG 7 – Erschwingliche und saubere Energie

Elektronische Version(en)

https://doi.org/10.1016/j.solmat.2013.06.012 (Zugang: Geschlossen)