Laser Welding for Processing of Thin Crystalline Si Wafers

authored by

Marco Ernst, Verena Steckenreiter, Sarah Kajari-Schroder, Rolf Brendel

Abstract

Thin crystalline Si films (<100 μm) are used in many applications, such as sensors, photovoltaic absorbers, and optical and particle filters. Such thin crystalline Si films are difficult to handle and break easily under standard semiconductor processing. This paper presents a laser-welding process for the mechanical connection of a thin Si film with a separate stabilizing frame that is also made of crystalline Si. We measure the tear-off stresses to be in the range of 17-50 kPa. The supported thin Si films withstand typical semiconductor processes such as plasma deposition, oxidation, and wet chemical cleaning.

Organisation(s)

Solar Energy Section

External Organisation(s)

Institute for Solar Energy Research (ISFH)
Australian National University

Type

Article

Journal

IEEE journal of photovoltaics

Volume

5

Pages

1335-1339

No. of pages

5

ISSN

2156-3381

Publication date

10.07.2015

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials, Condensed Matter Physics, Electrical and Electronic Engineering

Sustainable Development Goals

SDG 7 - Affordable and Clean Energy

Electronic version(s)

https://doi.org/10.1109/JPHOTOV.2015.2449652 (Access: Closed)