Directional heating and cooling for controlled spalling
- verfasst von
- Jan Hensen, Raphael Niepelt, Sarah Kajari-Schroder, Rolf Brendel
- Abstract
The fabrication of thin solar cells by kerfless wafering techniques offers a high potential for the reduction of photovoltaic costs. We present an experimental setup for the exfoliation of thin crystalline silicon foils from a silicon substrate induced by the difference in thermal expansion coefficient of the silicon and an aluminum stressor layer at moderate temperatures. A moving temperature gradient across the substrate controls the crack propagation parallel to the silicon surface. We measure and simulate the spatial temperature distribution during thermal treatment and find that the direction of crack propagation is controlled by the temperature distribution. We detach foils with an area of 19.6 cm2 with thickness values ranging from 50 to 80 μm within one layer. The foils have a smooth surface with some irregularities near the edge.
- Organisationseinheit(en)
-
Abt. Solarenergie
- Externe Organisation(en)
-
Institut für Solarenergieforschung GmbH (ISFH)
- Typ
- Artikel
- Journal
- IEEE journal of photovoltaics
- Band
- 5
- Seiten
- 195-201
- Anzahl der Seiten
- 7
- ISSN
- 2156-3381
- Publikationsdatum
- 01.01.2015
- Publikationsstatus
- Veröffentlicht
- Peer-reviewed
- Ja
- ASJC Scopus Sachgebiete
- Elektronische, optische und magnetische Materialien, Physik der kondensierten Materie, Elektrotechnik und Elektronik
- Ziele für nachhaltige Entwicklung
- SDG 7 – Erschwingliche und saubere Energie
- Elektronische Version(en)
-
https://doi.org/10.1109/JPHOTOV.2014.2371233 (Zugang:
Unbekannt)
