Aluminum-Based Mechanical and Electrical Laser Interconnection Process for Module Integration of Silicon Solar Cells

verfasst von

Henning Schulte-Huxel, Robert Bock, Susanne Blankemeyer, Agnes Merkle, Rolf Brendel

Abstract

In this paper, an interconnection method for the module integration of silicon solar cells by laser microwelding of the Al-metalized rear side of the solar cell to a metalized substrate is introduced. This laser microwelding process forms a direct mechanical and electrical connection between two Al-layers without the need for any soldering, conductive adhesives, or Ag-pastes. With a tensile tester, we measure tear-off stresses of up to 303kPa for our laser weld spots. Furthermore, carrier lifetime measurements show that no defects are induced into the Si-crystal by the laser process over a wide range of laser pulse energies and number of laser pulses. In order to demonstrate the applicability of this laser-based interconnection method, we present a proof-of-concept module consisting of five n-type back-junction back-contact solar cells with a conversion efficiency of 20.0%.

Organisationseinheit(en)

Abt. Solarenergie

Externe Organisation(en)

Institut für Solarenergieforschung GmbH (ISFH)

Typ

Artikel

Journal

IEEE journal of photovoltaics

Band

2

Seiten

16-21

Anzahl der Seiten

6

ISSN

2156-3381

Publikationsdatum

29.12.2011

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektronische, optische und magnetische Materialien, Physik der kondensierten Materie, Elektrotechnik und Elektronik

Ziele für nachhaltige Entwicklung

SDG 7 – Erschwingliche und saubere Energie

Elektronische Version(en)

https://doi.org/10.1109/JPHOTOV.2011.2177072 (Zugang: Geschlossen)